WebTiN etc. We could also demonstrate high bonding strength at the wafer edge for reduced trim edge exclusion as 2 mm for Trim first applications. In addition, abrasive tapes with large size diamonds grains enable high removal rate as well as larger polish amount, which allows reaching the conventional 100µm trim recommended for bonding.

The effects of edge trimming - DISCO

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Web100 µm thick wafers could be further split into two groups based on the quality of the edge trim. Thirty-eight wafers had visibly poor edge quality, as shown in Figure 6a. The remaining 9, plus all of the 50 µm thick wafers, had much smoother edge quality, as shown in Figure 6b. Packaging procedure The wafers were placed in the primary ... WebWafer Bevel Machine Features: Compact Design - 50% less foot print area compared to existing model DENP-250A and competitors High Accuracy - By utilizing one-piece cast iron frame, the vibration during grinding was better controlled and damage on wafer edge, which minimizes chipping. WebA process called “Edge trimming” effectively removes the rounded shape on the outer edge of the wafer which causes edge chipping, preventing the wafer from breaking. In this … dkny asha mini north south crossbody handbag